Chem-Mat’s Acu-Coat UV169 is a one component, fast cured, low viscosity, high hardness, light cured coating product. It is designed as an abrasion and scratch resistant protective coating. Examples of uses of this UV hard coating include: clear coating of assembled equipment and parts, and protective coating used in electronic and electric components.

Chem-Mat’s Acu-Tite UV24E is a one part, high clarity, high water resistant light cured adhesive for glass/glass bonding. It is designed primarily for bonding soft glass, borosilicate glass, lead crystal, steel, plated metals and thermoset plastics. The cured adhesive provides a crystal clear, high strength, water and environmentally resistant bond.

Chem-Mat’s Acu-Tite UV298B is designed for rapid, solvent-free bonding of clear or translucent acrylic, polycarbonate, PVC alloys and polyurethane. It cures in seconds upon exposure to high intensity UV light. Its clarity and low viscosity produces clear, bubble-free bond lines.

Chem-Mat’s conformal coating is a one component, fast UV cured system that can be applied over the entire PCB surface or discreet areas to provide complete protection from harsh environments or solvents and to provide security masking of PCB’s.

Chem-Mat’s conformal coating is a one component, highly flexible, low shrinkage, visible/ UV light cured system that is designed to provide complete protection from moisture and other harsh environments when applied over entire PCB surface or discreet masked areas.

Chem-Mat’s HTG008 is a one part, high Tg, low moisture permeable, fast light cured adhesive/sealant designed for OLEF, PLED and related electronic encapsulation applications. It features excellent sealing, and low CTE characteristics as well as good adhesion to various substrates including glass, metal and ceramics.

Chem-Mat’s Acu-Tite UV101K is a single component, medium viscosity, high clarity, fast light cured adhesive. It features high hardness, clarity and good adhesion to various substrates including glass, metal and ceramics.

Chem-Mat’s Acu-Tite UVEP178 is a light cured, low viscosity, epoxy adhesive and coating product. This product is not subjected to oxygen inhibition as are the free radical cured acrylic systems. The cationic cured epoxy adhesive can be used effectively on substrates that are not transparent to UV radiation. This "dark cure" mechanism is also used effectively for lamination of opaque substrates.

Chem-Mat’s Acu-Tite UV226 light cured pressure sensitive adhesive provides aggressive tack and tailor-made peel adhesion strength for industrial tooling applications of optical devices.

Chem-Mat’s UV1350C and 1374C are one part, high clarity, fast cure, low shrinkage light cured adhesives specifically designed for optical lens bonding. These adhesives have excellent adhesion to a variety of plastic, glass and metal substrates. The combination of high adhesion, low shrinkage and good elongation virtually eliminates birefringence from occurring in lens assemblies.

Chem-Mat’s UV10 is a one part, high clarity, fast cure, low shrinkage, highly flexible light cured adhesive/sealant specifically designed for gasketing/sealing of electronic devices. The cured film has high elongation and flexibility. The hardness of cured film is in the range of Shore A of 60 to 70 which is comparable to some cured silicone resins. The combination of high adhesion, low shrinkage and high flexibility provide excellent sealing and gasketing applications in the laminating and assembling process of high impact resistant plastic and metal components used in the electronics industry.

Chem-Mat’s Electrically Conductive Adhesives offer high electrical conductivity and strong bonding. Used in place of traditional soldering on heat sensitive components, they are useful in repairing defective traces and creating jumpers on boards. Electrically conductive adhesives can be used as an effective heat sink and to connect flexible circuits or attach EMI/RFI shields to electronic equipment. Chem-Mat offers three grades of electrically conductive adhesives each with different viscosity, resistivity, bonding strength, and flexibility characteristics.

Chem-Mat’s Acu-Therm 1300 series Thermally Conductive Adhesives and Potting Compounds are one-part, activator-cured products. They provide the heat dissipation required for protection of many heat sensitive electronic and electric components. It bonds to glass, ceramics, metals and plastics. Applications include solder replacement, semiconductor bonding, shielding, electronics, quick repairs, heat transfer, etc. Chem-Mat offers three types of thermally conductive adhesives each with different viscosity, thermal conductivity and bonding strength characteristics.

Chem-Mat’s Acu-Encap EP183 and EP221 are 100% reactive, one component, high viscosity, low temperature thermal cured, high profile globe-top epoxy encapsulants. They provide excellent penetration, even into tightly wound coils. Just dispense and cure at an elevated temperature to provide excellent moisture and chemical resistance.

Chem-Mat’s Acu-Encap EP281 is a single component, thermal cured epoxy encapsulant designed for use as a re-workable underfill resin for CSP (FBGA) or BGA. It cures rapidly with exposure to heat and gives excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.

Chem-Mat’s Acu-Tite EP289A is a one part, thermal cured epoxy adhesive/sealant specifically designed for bonding and sealing of electronic devices. It has low shrinkage and high flexibility features that provide excellent sealing and impact resistance properties.

Chem-Mat’s Acu-Tite DL200 series Pre-applied Threadlockers are dry-to-the touch films applied to threaded fasteners for enhancing speed of assembly and ensuring quality by eliminating on-line dispensing of liquid adhesives. Three grades are specially formulated for various strengths, temperature resistance, lubricity and fastener finishes.

Chem-Mat’s Acu-Tite HT196 is a high temperature inorganic adhesive designed for ceramics, glass or metal bonding where high temperature capabilities (>1000°C) are required. This adhesive requires a step-wise thermal cure at temperatures from 100-260°C to reach a full cure.

Chem-Mat’s SMA201M is a one part, low temperature fast cure, non-slumping, non-stringing surface mount epoxy adhesive. It is formulated with controlled rheology to provide excellent high-speed printing for use with fine pitch components. It offers low moisture sensitivity and good stability at room temperature. When fully cured, this product provides excellent adhesion to a wide variety of substrates and has a glass transition temperature (Tg) of 80°C to 100°C for easy removal.

Chem-Mat’s 3D dome and decorative coatings are one part, solvent-free, UV cured products that produce a 3D, crystal clear, non-yellowing protective and decorative coating. Ideal for labels, badges, name tags, pens, key chains, decals and other novelties.

Chem-Mat’s Acu-Tite UV928 adhesive/sealant is designed for sealing and plugging fill holes on LCD panels. Acu-Tite UV928 bonds glass, epoxy composite, metal, phenolic, filled nylon, ferrite, ceramic and other materials. The high viscosity of UV828 minimizes contact with the LCD fluid. This product can also be used to bond metal connector legs to the glass LCD panel.

Chem-Mat’s Acu-Tite UV157 high index LED coating is a one part, fast light-cured coating/encapsulating product. It is made to enable LEDs to endure higher temperatures, resist yellowing and allows white and blue LEDs to stay bright and for colored LEDs to emit their true color. These products are designed to extend durability requirements of LEDs in optoelectronic applications and are excellent for casting, potting and doming of LED products.